In recent years, due to an increasing level of electromagnetic (EM) pollution, the electronic circuits are confronting rising demands on electromagnetic compatibility (EMC). Since EMC has become one of the major causes of printed circuit board (PCB) and integrated circuit redesign, the prediction of the EM field interference is of great importance. Standardized EMC tests enable the assessment of the compliance of electronic circuits to the imposed norms. Inability of the electronic circuit to comply with the standards may result in significant increase of production cost and time to market. The goal of this research is to enable circuit simulations of EMC pre-compliance tests of critical elements of electronic circuits, i.e. interconnects. The development of circuit models of the EM coupling to interconnects enables identification of possible radiated EMC issues during the circuit design flow and consequently decrease the production cost and increase system reliability. The TEM cell and IC-Stripline present the standard methods for the radiated emission and immunity pre-compliance EMC tests. In this work, the TEM cell and IC-Stripline equivalent circuit models are developed as well as the circuit models of EM field coupling to the printed circuit board traces. The interconnects considered in this work are IC packages and transmission lines. The response surface methodology based on EM simulations is used to build scalable circuit models of IC packages. The broadband modelling of SMA connectors and transmission lines is performed. The accuracy of the developed circuit models is very good and the models present a significant step towards reliable circuit simulations of the complex electronic system pre-compliance EMC tests.